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SK-H2 universal preheating platform for mobile phone motherboard layered bonding glue removal dot matrix repair heating table

SK-H2 universal preheating platform for mobile phone motherboard layered bonding glue removal dot matrix repair heating table

From Store#4645165

US $30.61

Price History

This is our record of AliExpress price changes for SK-H2 universal preheating platform for mobile phone motherboard layered bonding glue removal dot matrix repair heating table since we began monitoring it on April 27, 2025.

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