SK-H2 universal preheating platform for mobile phone motherboard layered bonding glue removal dot matrix repair heating table
From Store#4645165
$30.61
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5.0 out of 5 (1 sold)
Price History
Price changes for SK-H2 universal preheating platform for mobile phone motherboard layered bonding glue removal dot matrix repair heating table since Apr 27, 2025
Max: $30.61
Min: $30.61
Current: $30.61
