Heat Insulation Planting Tin Pad for Mobile Phone Repair AMAOE PD-C BGA Reballing Platform CPU IC Rework Adsorption Silicon Mat
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$4.96
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Highest recorded price: $20.24
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Price History
Price changes for Heat Insulation Planting Tin Pad for Mobile Phone Repair AMAOE PD-C BGA Reballing Platform CPU IC Rework Adsorption Silicon Mat since Apr 11, 2025
Max: $20.24
Min: $4.96
Current: $4.96





